Technical Details

• Package / Case 153-FBGA
• Mounting Type Surface Mount
• Memory Size 256Gbit
• Memory Type Non-Volatile
• Operating Temperature -40°C ~ 85°C
• Voltage - Supply 1.8V, 3.3V
• Technology FLASH - NAND (TLC)
• Memory Format FLASH
• Supplier Device Package 153-FBGA (11.5x13)
• Memory Interface eMMC
• Memory Organization 32G x 8
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status Vendor Undefined
• RoHS Status ROHS3 Compliant