Technical Details

• Package / Case Nonstandard Chip
• Size / Dimension 0.020" L x 0.079" W (0.50mm x 2.00mm)
• Operating Temperature -55°C ~ 150°C
• Height 0.010" (0.25mm)
• Applications High Stability, Vertical Silicon Cap, Wirebond
• Capacitance 2700 pF
• Voltage - Breakdown 150 V
• ECCN EAR99
• HTSUS 8532.29.0040
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant