技术参数

• Package / Case 288-LBGA Exposed Pad
• Mounting Type Surface Mount
• Function Line Interface Unit (LIU)
• Interface E1, J1, SPI, T1
• Operating Temperature -40°C ~ 85°C
• Voltage - Supply 1.71V ~ 1.89V, 3.135V ~ 3.465V
• Current - Supply 916mA
• Supplier Device Package 288-TSBGA (23x23)
• Number of Circuits 8
• Power (Watts) 2.29 W