技术参数

• Package / Case 6-XFDFN Exposed Pad
• Output Type Push-Pull, Rail-to-Rail
• Mounting Type Surface Mount
• Number of Elements 1
• Type CMOS
• Operating Temperature -40°C ~ 125°C
• Voltage - Supply, Single/Dual (±) 2.7V ~ 5.5V
• Supplier Device Package 6-DFN (1.6x1.6)
• Propagation Delay (Max) 35µs (Typ)
• Current - Quiescent (Max) 300µA
• Voltage - Input Offset (Max) 9mV @ 5V
• Current - Input Bias (Max) 1pA @ 5V
• Current - Output (Typ) 85mA
• CMRR, PSRR (Typ) 70dB CMRR, 85dB PSRR
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)