技术参数

• Package / Case 153-LFBGA
• Mounting Type Surface Mount
• Memory Size 128Gbit
• Memory Type Non-Volatile
• Operating Temperature -25°C ~ 85°C
• Voltage - Supply 1.8V ~ 3.3V
• Technology FLASH - NAND (TLC)
• Memory Format FLASH
• Supplier Device Package 153-LFBGA (11.5x13)
• Memory Interface eMMC
• Memory Organization 16G x 8
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• RoHS Status ROHS3 Compliant