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传感器和检测器接口
SMART SENSOR -> BUMPED DIE
库存: 1500
TSSOP / 16 / 5X4MM-0
WAFER UNSAWN, 725U, WITH INKING
DICE ON 304 MICRO METER WAFER NO
ZSSC3230BI6B (WAFER UNSAWN, 725,
WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - FRAME
DICE ON 725 MICRO METER WAFER NO
DICE ON 304 MICRO METER WAFER WI
